Induction bonding is curing process for bonding material, the curing material can be either single pot or two pot Epoxy or other compound. Induction bonding is an alternate method to induction brazing process. Magnetotherm based Induction bonding where the component temperature is precisely elevated for molecular bonding to ensure proper adhesion.

It mainly used in bonding adhesive or sealant for various automobile parts, and bonding can be between metal to metal or Composite to metal. The entire process of induction bonding can be controlled in such a way once the bonding temperature raises to max of 320°C, the system turn off to ensure curing of adhesive.

In general as per our internal experimental results prove that Induction bonding generally happens at an elevated temperature between 180°C to 320°C. Benefits of Magnetotherm based Induction Bonding :